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  6. 3M™ Polyimide Film Tape 5413, Gold, 304,8 mm x 32,9 m x 0,07 mm, 1 roll/case

3M™ Polyimide Film Tape 5413, Gold, 304,8 mm x 32,9 m x 0,07 mm, 1 roll/case

  • 3M ID 7000048687
  • UPC 00021200735011

Provides excellent surface release and remains dimensionally stable at high temperatures – preventing rework

Flame retardancy, chemical and radiation resistance protects surfaces and helps reduce replacement costs

Polyethylene tape core instead of cardboard

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Frequently viewed resources
Tech Data Sheet (PDF, 116KB)
Overall Width (Metric) 304.8 mm
Total Tape Thickness without Liner (metric) 0.069 mm
Product Color Amber
Overall Length (Metric) 33 m
Adhesive Type Silicone

Details

Highlights
  • Provides excellent surface release and remains dimensionally stable at high temperatures – preventing rework
  • Flame retardancy, chemical and radiation resistance protects surfaces and helps reduce replacement costs
  • Polyethylene tape core instead of cardboard
  • Silicone adhesive's high temperature performance reduces adhesive transfer – eliminating cleaning
  • Available on cardboard or polyethyelene core

3M™ Polyimide Film Tape 5413 is made with polyimide film and a silicone adhesive. This amber coloured tape is 2.7 mil thick and can be used for PCB solder masking and other high temperature applications, within a range of -73 °C to 260 °C.

Use 3M™ Polyimide Film Tape 5413 for PCB solder masking and other high temperature applications within a range of -73 °C to 260 °C. This amber coloured, 2.7 mil thick tape is made with an polyimide film and a silicone adhesive. It also features a polyethylene tape core instead of cardboard. The silicone adhesive's high temperature performance reduces adhesive transfer which helps eliminate cleaning, allowing you to keep productivity high. Polyimide film provides an excellent release as it doesn’t soften and stays dimensionally stable at high temperatures – preventing rework. Surfaces are protected due to this tapes flame retardancy, chemical and radiation resistance, reducing replacement costs.

Suggested applications
  • Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
  • Release surface in fabrication of parts cured at elevated temperature

Specifications

Resources