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3M™ Diamond Pad Conditioner C Series

  • 3M Product Number C Series
  • 3M ID B5005469001

Optimized diamond shape, pitch control and diamond orientation

Improved consistency and reduced disk-to-disk variation

Slower pad wear rate decay with stable removal rate and profile

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PDF (1) Copy 26Tech Data Sheet (PDF, 176KB)

Details

Highlights
  • Optimized diamond shape, pitch control and diamond orientation
  • Improved consistency and reduced disk-to-disk variation
  • Slower pad wear rate decay with stable removal rate and profile
  • Enables potential for longer disk life and pad life
  • Uses 3M sintered abrasive technology for firm diamond adhesion
  • 40% improvement in flatness control over legacy designs
  • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
  • A good choice for metal-sensitive processes when combined with 3M™ CMP Pad Conditioner Coatings

3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimizes wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.

  • Icon of three CMP pads representing improved consistency
    Improved Consistency
  • Icon of a cross-section of CMP pad showing diamond height representing optimized topography
    Optimized Topography
  • Icon of a diamond pad next to a checklist representing tunable performance.
    Tunable Performance
3M CMP products mapped out by disk aggressiveness and pad roughness
Broad range of conditioning performance options

Extra-precise diamond placement

  • Microscopic image showing legacy diamond placement next to a graphic showing diamond height inconsistencies.
    Legacy 3M pad conditioner
  • Microscopic image showing new diamond placement next to a graphic showing diamond height consistency.
    3M™ Diamond Pad Conditioner C Series

Specifications

Resources

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