Bringing together 3M’s know-how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.
Featuring precisely shaped, three-dimensional abrasive structures, 3M™ Trizact™ Pad Conditioner is ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication — a core 3M technology applied to advanced node semiconductor manufacturing — these structures are reproduced uniformly across the 3M™ Trizact™ Pad Conditioner surface. What’s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.