Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.

Strong, durable bristles are independently anchored and evenly distributed across the 3M brush surface, making the 3M brush ideal for removing pad debris from soft microreplicated, porometric and felt-based CMP pads. Bristles are made from an exclusive polymer that resists corrosion much better than metal. The polycarbonate carrier features a universal mounting configuration, making for easy connection to a wide range of polishing tools and effectors.
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