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3M™ UV-Curable Adhesive LC-3200

  • 3M Product Number LC-3200
  • 3M ID B5005035148

UV-Curable Adhesives enable fast curing and high thru put while helping to eliminate solvents and waste

100% solid acrylic adhesives

Compatible with typical semiconductor process chemistries and processes

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PDF (1) Copy 26Tech Data Sheet (PDF, 64KB)

Details

Highlights
  • UV-Curable Adhesives enable fast curing and high thru put while helping to eliminate solvents and waste
  • 100% solid acrylic adhesives
  • Compatible with typical semiconductor process chemistries and processes
  • Compatible with the 3M™ Wafer Support System
  • Compatible with typical semiconductor process chemistries and processes
  • Used as part of the 3M™ Wafer Support System

3M™ UV-Curable Adhesive LC-3200 is a 100% solids UV curable acrylic adhesive. 3M adhesive LC-3200 is suitable for temporary wafer bonding of silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System.

The versatile heart of the temporary bonding and debonding process

  • Graphic of temporary bonding and debonding process

  • A. Semiconductor wafer
    B. 3M™ UV-Curable Adhesive LC-3200 (this product)
    C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
    D. Glass carrier

    3M™ Liquid UV-Curable Adhesive LC-3200 is applied between the semiconductor wafer and the customer-supplied support glass carrier. Rubber based adhesive cures under UV light. It laminates to the wafer and, when used with 3M™ Light-to-Heat-Conversion Release Coating, bonds firmly but temporarily to the glass carrier. It debonds cleanly via laser irradiation, preserving the integrity of the glass carrier for reuse and recycling.

Specifications

Resources

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