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  6. 3M™ Low Static Polyimide Film Tape 5419, Gold, 25,4 mm x 32,9 m x 0,07 mm, 9 rolls/case

3M™ Low Static Polyimide Film Tape 5419, Gold, 25,4 mm x 32,9 m x 0,07 mm, 9 rolls/case

  • 3M ID 7000144792
  • UPC 00021200648663

Use a tape with extremely low electrostatic discharge properties

Keep productivity high with no need for rework

Protect surfaces and lessen the need for replacement parts

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Frequently viewed resources
Tech Data Sheet (PDF, 113KB)
Overall Width (Metric) 25.4 mm
Total Tape Thickness without Liner (metric) 0.069 mm
Product Color Gold
Overall Length (Metric) 33 m
Adhesive Type Silicone

Details

Highlights
  • Use a tape with extremely low electrostatic discharge properties
  • Keep productivity high with no need for rework
  • Protect surfaces and lessen the need for replacement parts
  • Gold tab protection during wave solder of printed circuit boards
  • RoHS compliant

Mask printed circuit boards during wave solder or solder dip process with 3M™ Low Static Polymide Film Tape 5419. Our excellent polyimide film tape is ideal for high temperature applications. It has a silicone adhesive backing and extremely low electrostatic discharge properties.

Get 3M™ Low Static Polymide Film Tape 5419 for its extremely low electrostatic discharge properties. Our translucent tape is perfect for masking printed circuit boards during wave solder or solder dip processing. Our tape is designed with a technology that results in extremely low electrostatic discharge at unwind and removal from the PWB. Conventional polyimide tapes typically generate over 10,000 volts during use which can damage board mounted electronic components. It overcomes this problem without any of the typical drawbacks of conventional ‘anti-static’ or ‘static-free’ tapes (e.g. variable adhesion and opaqueness). The polyimide film does not soften at high temperatures, offering a good release surface, and by protecting surfaces, our tape helps to reduce replacement parts. It also fosters high productivity, as no rework is needed. Available with both polyethylene and cardboard tape core.

Suggested applications
  • Mask for printed circuit boards during wave solder or solder dip process
  • Used as release surface in fabrication of parts cured at elevated temperatures

Specifications

Resources

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